Actas de congresos
Integration Of Microfabricated Capacitive Bridge And Thermistor On The Alumina Substrates
Registro en:
9781607683636
Ecs Transactions. , v. 49, n. 1, p. 451 - 458, 2009.
19385862
10.1149/04901.0451ecst
2-s2.0-84875843371
Autor
Costa J.S.
Flacker A.
Nakashima M.H.S.
Fruett F.
Zampieri M.
Longo E.
Institución
Resumen
This paper describes a thin film fabrication technique of planar metallic microstructure with geometries between 10 and 20μm on 96% alumina substrate. This technique integrates a microfabricated capacitive bridge and thermistor on the same substrate employing metal and vacuum deposition. The procedure showed good resolution using a substrate with medium grain size between 3-5μm and average peak to valley surface roughness (Ra) 0.1μm. The film adhesion was tested by soldering metallic wires on the capacitor electrodes. These structures can be used for thin film characterization. We also deposited an oxide thin film (TiO2:WO3) by using polymeric precursors method. © The Electrochemical Society. 49 1 451 458 Auerkari, P., (1996) ESPOO, , Technical Research Centre of Finland Sze, S.M., (1988) VLSI Technology, p. 596. , McGraw-Hill, New York Hwang, B.J., Lin, S.H., (1995) J. Electrochem. Soc., 142, p. 3749 Severin, J.W., With, G., (1993) J. Adhesion Sci. Technol., 7, p. 115 Honma, H., Kanemitsu, K., (1987) Plat. and Surf. Fin., 62 Severin, J.W., Hokke, R., Van Der Wel, H., De With, G., (1983) J. Electrochem. Soc., 140, p. 682 Shrivastava, P.B., Venkatramani, N., Rohatgi, V.K., Totalni, M.K., Mital, C.K., (1985) Metal Fin., 18, p. 65 Campos, C.D.M., Flacker, A., Vaz, A.R., Moshkalev, S.A., Nóbrega, E.G., (2011) J. Electrochem. Soc., 158, pp. D330 Dubin, V.M., Dobson, S.D., Rose, D., Hodes, G., (2001) Thin Solid Film, 387, p. 155 Costa, J.S., Flacker, A., Fruett, F., (2009) ECS Trans, 327 Zampieri, M., (2009) Preparação Dos Eletrodos ÓXidos Cerâmicos Para Aplicação Em Filmes Finos do Tipo Pb1-xCa xTiO3, p. 19. , Ufscar, São Carlos