dc.creatorLacerda R.G.
dc.creatorMarques F.C.
dc.date1998
dc.date2015-06-30T15:04:05Z
dc.date2015-11-26T15:11:56Z
dc.date2015-06-30T15:04:05Z
dc.date2015-11-26T15:11:56Z
dc.date.accessioned2018-03-28T22:22:03Z
dc.date.available2018-03-28T22:22:03Z
dc.identifier
dc.identifierApplied Physics Letters. , v. 73, n. 5, p. 617 - 619, 1998.
dc.identifier36951
dc.identifier10.1063/1.121874
dc.identifierhttp://www.scopus.com/inward/record.url?eid=2-s2.0-0000696411&partnerID=40&md5=fbe424937c881cc436f2cad7cd5e2799
dc.identifierhttp://www.repositorio.unicamp.br/handle/REPOSIP/100418
dc.identifierhttp://repositorio.unicamp.br/jspui/handle/REPOSIP/100418
dc.identifier2-s2.0-0000696411
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/1258264
dc.descriptionAnalysis of hard a-C:H films with low stress prepared by methane plasma decomposition is reported. Films with hardness as high as 14 GPa and stress as low as 0.5 GPa were obtained. These films have a high Raman Id/Ig ratio (∼1.0), and small Tauc's band gap (∼0.4 eV). This letter also supplies strong evidence that the subimplantation deposition model, used to explain the formation of ta-C and ta-C:H films, is also valid for a-C:H films deposited by methane plasma decomposition. It is proposed that the rigidity of the films is basically provided by a matrix of dispersed cross-linked sp2 sites, in addition to the contribution of the sp3 sites. © 1998 American Institute of Physics.
dc.description73
dc.description5
dc.description617
dc.description619
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dc.languageen
dc.publisher
dc.relationApplied Physics Letters
dc.rightsaberto
dc.sourceScopus
dc.titleHard Hydrogenated Carbon Films With Low Stress
dc.typeArtículos de revistas


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