The Roles Of Dendritic Spacings And Ag3sn Intermetallics On Hardness Of The Sac307 Solder Alloy

dc.creatorSilva B.L.
dc.creatorGarcia A.
dc.creatorSpinelli J.E.
dc.date2014
dc.date2015-06-25T17:57:27Z
dc.date2015-11-26T14:52:01Z
dc.date2015-06-25T17:57:27Z
dc.date2015-11-26T14:52:01Z
dc.date.accessioned2018-03-28T22:03:57Z
dc.date.available2018-03-28T22:03:57Z
dc.identifier
dc.identifierMicroelectronics Reliability. Elsevier Ltd, v. 54, n. 12, p. 2929 - 2934, 2014.
dc.identifier262714
dc.identifier10.1016/j.microrel.2014.07.126
dc.identifierhttp://www.scopus.com/inward/record.url?eid=2-s2.0-84914168036&partnerID=40&md5=011c11f49e8d2d9f88cf2c6ec20f0acd
dc.identifierhttp://www.repositorio.unicamp.br/handle/REPOSIP/87252
dc.identifierhttp://repositorio.unicamp.br/jspui/handle/REPOSIP/87252
dc.identifier2-s2.0-84914168036
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/1254694
dc.descriptionSn-Ag-Cu alloys have emerged as the most promising lead-free solder series among a number of alternatives. These alloys generally present a dendritic Sn-rich matrix surrounded by a eutectic mixture (β + α), where β is the Sn-rich phase and α is the Ag3Sn intermetallic compound. The present study aims to investigate the effects of dendritic (λ2, λ3) and eutectic (λ) spacings and the morphology of Ag3Sn particles on hardness of the Sn-3.0 wt%Ag-0.7 wt%Cu alloy (SAC307). In order to establish correlations between λ2,3 and hardness, transient directional solidification (DS) experiments were performed permitting a wide range of different microstructures to be examined. The techniques used for microstructure characterization included dissolution of the Sn-rich matrix, optical/scanning electron microscopy. A dendritic microstructure prevailed in the entire DS casting. It is shown that the hardness tends to decrease with the increase in λ2, λ3 and λF (eutectic spacing for Ag3Sn having a fiber morphology). Experimental equations relating microstructural spacings to hardness are proposed.
dc.description54
dc.description12
dc.description2929
dc.description2934
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dc.languageen
dc.publisherElsevier Ltd
dc.relationMicroelectronics Reliability
dc.rightsfechado
dc.sourceScopus
dc.titleThe Roles Of Dendritic Spacings And Ag3sn Intermetallics On Hardness Of The Sac307 Solder Alloy
dc.typeArtículos de revistas


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