dc.creatorLagoia Fonseca Jr. P.N.
dc.creatorKretly L.C.
dc.date2008
dc.date2015-06-30T19:20:01Z
dc.date2015-11-26T14:42:17Z
dc.date2015-06-30T19:20:01Z
dc.date2015-11-26T14:42:17Z
dc.date.accessioned2018-03-28T21:49:45Z
dc.date.available2018-03-28T21:49:45Z
dc.identifier9781424418794
dc.identifier2008 International Conference On Microwave And Millimeter Wave Technology Proceedings, Icmmt. , v. 2, n. , p. 580 - 583, 2008.
dc.identifier
dc.identifier10.1109/ICMMT.2008.4540459
dc.identifierhttp://www.scopus.com/inward/record.url?eid=2-s2.0-51349117354&partnerID=40&md5=ac27d971446d0829922d8e8f122c7a71
dc.identifierhttp://www.repositorio.unicamp.br/handle/REPOSIP/105798
dc.identifierhttp://repositorio.unicamp.br/jspui/handle/REPOSIP/105798
dc.identifier2-s2.0-51349117354
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/1251198
dc.descriptionThis paper presents a technique to improve RF integrated inductor performance, incorporating double ground shield using polysilicon and n+ buried layer, providing a fully shield and preventing the electric field penetration. This method was compared with conventional inductors and improves Q-factor up to 50% at 3.5, 4 and 5 GHz. The results were obtained based on AMS 0.35μm BiCMOS technology. This technique can be applied to any BiCMOS technology with no additional process. ©2008 IEEE.
dc.description2
dc.description
dc.description580
dc.description583
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dc.descriptionAustriamicrosystems, 0.35 m HBT BiCMOS Process Parameters, , Application Note ENG-219 Rev. 3.0
dc.descriptionhttp://www.sonnetusa.com, Sonnet Software Inc. AvailableBurghartz, J.N., Ruehli, A.E., Jenkins, K.A., Soyuer, M., Nguyen-Ngoc, D., Novel substrate contact structure for high-Q silicon-integrated spiral inductors (1997) Tech. Dig. Int. Electron Devices Meeting (IEDM), pp. 55-58
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dc.languageen
dc.publisher
dc.relation2008 International Conference on Microwave and Millimeter Wave Technology Proceedings, ICMMT
dc.rightsfechado
dc.sourceScopus
dc.titleRf Integrated Inductor: Improving Q-factor With Double Ground Shield For Bicmos Technology
dc.typeActas de congresos


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