Electroless Deposited Nickel Hard Mask For High Density Plasma Etching Applications

dc.creatorNunes A.M.
dc.creatorMoshkalev S.A.
dc.creatorFlacker A.
dc.creatorTatsch P.I.
dc.creatorBesseler E.
dc.date2008
dc.date2015-06-30T19:17:14Z
dc.date2015-11-26T14:41:27Z
dc.date2015-06-30T19:17:14Z
dc.date2015-11-26T14:41:27Z
dc.date.accessioned2018-03-28T21:48:21Z
dc.date.available2018-03-28T21:48:21Z
dc.identifier9781566776462
dc.identifierEcs Transactions. , v. 14, n. 1, p. 403 - 411, 2008.
dc.identifier19385862
dc.identifier10.1149/1.2956055
dc.identifierhttp://www.scopus.com/inward/record.url?eid=2-s2.0-57749177422&partnerID=40&md5=b63a46c73ce3e510491a8093a14a6ee3
dc.identifierhttp://www.repositorio.unicamp.br/handle/REPOSIP/105588
dc.identifierhttp://repositorio.unicamp.br/jspui/handle/REPOSIP/105588
dc.identifier2-s2.0-57749177422
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/1250843
dc.descriptionNi electroless films were used as a material for hard mask during highdensity ICP plasma etching. The results have shown that under the plasma exposure strong hardening of the mask occurs and the rate of Ni film removal falls at least an order of magnitude as compared with its initial value. Therefore, very high selectivities for Si etching over Ni are obtained, allowing for very deep etching required for some MEMS applications. © The Electrochemical Society.
dc.description14
dc.description1
dc.description403
dc.description411
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dc.languageen
dc.publisher
dc.relationECS Transactions
dc.rightsfechado
dc.sourceScopus
dc.titleElectroless Deposited Nickel Hard Mask For High Density Plasma Etching Applications
dc.typeActas de congresos


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