Dual beam FIB (focused ion beam)/SEM (scanning elelctron microscope) systems are commonly used for imaging, selective etch and deposition of materials like platinum. The paper presents the results of electrical characterization of platinum thin films deposited by focused ion beam. For measurements, two types of test structures were fabricated: (i) 150×150 μm and 20×20 μm squares with thickness of 5, 10, 30 and 100 nm, and (ii) 30 μm long resistors with variable cross - section (50 nm × 50nm to 1 μm × 1μm). The Pt film resistivity has been measured by a four points probe method, to give the value of ∼10 × 10 -4 Ω.cm. © The Electrochemical Society.91235241Selinger, R.L., Fleming, W.P., (1974) Journal of Applied Physics, 45, pp. 1416-1422Go, M.S.H., Focused ion beam fabrication of junctions in the charge density wave conductor NbSe, (2001), M.S. thesis, Delft Univ. of Technol, Delft, The NetherlandsTao, T., Ro, J.S., Melngailis, J., Xue, Z., Kaesz, H.D., (1990) J. Vac. Sci. Technol, B 8 (6), pp. 1826-1829van der Pauw, L.J., (1958) Phillips Res. Rep, 13, pp. 1-9Tay, M., Li, K., Wu, Y., (2005) J. Vac. Sci. Technol, B 8 (23 4), pp. 1412-1416Kanagawa, T., Hobara, R., Matsuda, I., Tanikawa, T., Natori, A., Hasegawa, S., (2003) Physical Review Letters, 91 (3)Smith, S., Walton, A.J., Bond, S., Ross, A.W.S., Stevenson, J.T.M., Gundlach, A.M., (2003) IEEE Transactions on Semiconductor Manufacturing, 16 (2), pp. 199-206Ko, D., Park, Y.M., Kim, S., Kim, Y., (2007) Ultramicroscopy, 107, pp. 368-373Salvadori, M.C., Vaz, A.R., Farias, R.J.C., Cattani, M., (2004) Surface Review and Letters, 11 (2), pp. 223-227