dc.creatorTeixeira R.C.
dc.creatorDoi I.
dc.creatorZakia M.B.P.
dc.creatorDiniz J.A.
dc.date2005
dc.date2015-06-26T14:10:18Z
dc.date2015-11-26T14:10:25Z
dc.date2015-06-26T14:10:18Z
dc.date2015-11-26T14:10:25Z
dc.date.accessioned2018-03-28T21:11:08Z
dc.date.available2018-03-28T21:11:08Z
dc.identifier
dc.identifierProceedings - Electrochemical Society. , v. PV 2005-08, n. , p. 188 - 196, 2005.
dc.identifier
dc.identifier
dc.identifierhttp://www.scopus.com/inward/record.url?eid=2-s2.0-31844438333&partnerID=40&md5=f6c195efb95184812bed2f846c10858e
dc.identifierhttp://www.repositorio.unicamp.br/handle/REPOSIP/94014
dc.identifierhttp://repositorio.unicamp.br/jspui/handle/REPOSIP/94014
dc.identifier2-s2.0-31844438333
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/1241521
dc.descriptionIn this paper authors report morphological and deposition analysis of polySiGe thin films by means of AFM, SEM and Raman measurements and electrical characteristics of MOS capacitors using poly-SiGe electrodes. The samples were deposited in a pancake vertical LPCVD system using Silane and Germane as precursor gases in a Hydrogen carrier flow. The process pressure was 5 or 10 Torr, in a temperature range from 500°C to 750°C. Surface RMS roughness, grain size and deposition rate are evaluated. We found that very uniform films can be obtained, with rms roughness below 4 nm and grain size below 50 nm. Deposition rates as high as 1500 Å/min are achieved. The deposited samples presented Rs values well bellow similar poly-Si films and electrical characterization shows poly-SiGe as a suitable material for MOS devices.
dc.descriptionPV 2005-08
dc.description
dc.description188
dc.description196
dc.descriptionSalm, C., (1997) Pollycrystalline Germanium-silicon for Adevanced CMOS Technologies, , Doctorate Thesis
dc.descriptionUniversiteit Twente
dc.descriptionNetherlands
dc.descriptionHarame, D.L., Koester, S.J., Freeman, G., Cottrel, P., Rim, K., Dehlinger, G., Ahlgren, D., Subbanna, S., (2004) Applied Surface Science, p. 224
dc.descriptionFranke, A.E., Heck, J.M., King, T.J., Howe, R.T., (2003) Journal of Microelectromechanical Systems, 12, p. 2
dc.descriptionTeixeira, R.C., Doi, I., Diniz, J.A., Zakia, M.B.P., Swart, J.W., (2003) Influence of T on the Deposition Rate of Si-Poly Obtained by Vertical LPCVD, , XXIV CeBRAVIC, Bauru/SP, Brazil
dc.descriptionKrause, M., Stiebig, H., Carius, R., Zastrow, U., Bay, H., Wagner, H., (2002) Journal of Non Crystalline Solids, 299-302, pp. l
dc.descriptionTsang, J.C., Mooney, P.M., Dacol, F., Chu, J.O., (1994) Journal of Applied Physics, 75, p. 12
dc.descriptionJawhari, T., (2000) ANALVSIS, 28, pp. I
dc.descriptionKamins, T.I., (1998) Polycrystalline Silicon for Integrated Circuit and Displays, , Kluwer Academic Publishers, 2nd edition
dc.descriptionHauser, J.H., CVC Software, , North Caroline State University
dc.languageen
dc.publisher
dc.relationProceedings - Electrochemical Society
dc.rightsfechado
dc.sourceScopus
dc.titleMorphological And Electrical Study Of Poly-sige Alloy Deposited By Vertical Lpcvd
dc.typeActas de congresos


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