| dc.creator | Fischer C. | |
| dc.creator | Diniz J.A. | |
| dc.date | 2005 | |
| dc.date | 2015-06-26T14:09:57Z | |
| dc.date | 2015-11-26T14:10:10Z | |
| dc.date | 2015-06-26T14:09:57Z | |
| dc.date | 2015-11-26T14:10:10Z | |
| dc.date.accessioned | 2018-03-28T21:10:49Z | |
| dc.date.available | 2018-03-28T21:10:49Z | |
| dc.identifier | | |
| dc.identifier | Proceedings - Electrochemical Society. , v. PV 2005-08, n. , p. 408 - 415, 2005. | |
| dc.identifier | | |
| dc.identifier | | |
| dc.identifier | http://www.scopus.com/inward/record.url?eid=2-s2.0-31744434279&partnerID=40&md5=e47ea834b09296705f060dce5a137d04 | |
| dc.identifier | http://www.repositorio.unicamp.br/handle/REPOSIP/93921 | |
| dc.identifier | http://repositorio.unicamp.br/jspui/handle/REPOSIP/93921 | |
| dc.identifier | 2-s2.0-31744434279 | |
| dc.identifier.uri | http://repositorioslatinoamericanos.uchile.cl/handle/2250/1241444 | |
| dc.description | A microwave source system have been used to increase silicon etch rate in KOH solution by a factor of about 2, when compared to conventional process. In this work, using a commercial microwave oven (operated at 850W), a home-made microwave system and a polytetrafluoroethylene (PTFE) reactor, where the silicon etching is processed with KOH-water solution, were developed. Silicon wafers, previously oxidized and patterned with standard photo-lithographic process, were etched using 2.5, 5 and 10 M KOH-water solution. The process temperature was manually controlled. The etch solution passes through a heat exchanger for cooling purpose and is pumped back to the reactor. Etch rate of about 1.38 μm/min for the [100] silicon crystal plane and 2.7 nm/min for thermal silicon oxide was achieved. | |
| dc.description | PV 2005-08 | |
| dc.description | | |
| dc.description | 408 | |
| dc.description | 415 | |
| dc.description | Dziuban, J.A., (2000) Sensor and Actuators A, 85, p. 133 | |
| dc.description | Dziuban, J.A., Górecka-Drzazga, A., (2001) J. Vac. Sci. Technol. B, 19, p. 897 | |
| dc.description | Seidel, H., Csepregi, L., Heuberger, A., Baumgärtel, H., (1990) J. Electrochem. Soc., 137, p. 3612 | |
| dc.description | Seidel, H., Csepregi, L., Heuberger, A., Baumgärtel, H., (1990) J. Electrochem. Soc., 137, p. 3626 | |
| dc.description | Bean, K.E., (1978) IEEE Trans, on Electron Devices, ED-25, p. 1185 | |
| dc.description | Kovacs, G.T.A., Maluf, N.I., Petersen, K.E., (1998) Proc. IEEE, 86, p. 1536 | |
| dc.description | Petersen, K.E., (1982) Proc. IEEE, 70, p. 420 | |
| dc.description | Williams, K.R., Muller, R.S., (1996) Journal of Microelectromechanical Systems, 5, p. 256. , December | |
| dc.description | Williams, K.R., Gupta, K., Wasilik, M., (2003) Journal of Microelectromechanical Systems, 12, p. 761 | |
| dc.description | Madou, M.M., (2002) "Fundamentals of Microfabrication - The Science of Miniaturization", Second Edition, , CRC Press | |
| dc.language | en | |
| dc.publisher | | |
| dc.relation | Proceedings - Electrochemical Society | |
| dc.rights | fechado | |
| dc.source | Scopus | |
| dc.title | Microwave Enhanced Silicon Koh Etching | |
| dc.type | Actas de congresos | |
