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The correlation between thermal variables and secondary dendrite arm spacing during solidification of horizontal cylinders of Sn-Pb alloys
(Elsevier Science SaLausanneSuíça, 2005)
Microstructure development during directional solidification of Sn–Ag–Cu ternary alloys
(Maney Publishing, 2018-03)
Replace of Pb–Sn with Pb-free solders (LFS) is one of the most important issues in the electronic industry. Eutectic and near-eutectic Sn–Ag–Cu (SAC) alloys are recommended as lead-free replacement in welding processes of ...
Vertical and horizontal directional solidification of Zn-Al and Zn-Ag diluted alloys
(Japan Inst Metals, 2010-10)
Zinc-Aluminum and Zinc-Silver alloys were solidified in horizontal and vertical form and the results obtained analyzed. Thermal parameters such as the cooling rates, the liquidus and solidus interphase velocities, and the ...
Mechanical properties as a function of microstructure and solidification thermal variables of Al-Si castings
(Elsevier Science SaLausanneSuíça, 2006)
Cellular growth during transient directional solidification of Pb-Sb alloys
(Elsevier Science SaLausanneSuíça, 2006)
Tertiary dendrite arm spacing during downward transient solidification of Al-Cu and Al-Si alloys
(Elsevier Science BvAmsterdamHolanda, 2006)
Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloy
(Elsevier Science BvAmsterdamHolanda, 2014)
Microstructure morphologies during the transient solidification of hypomonotectic and monotectic Al-Pb alloys
(Elsevier Science SaLausanneSuíça, 2011)
The effect of solidification thermal variables on surface quality of Al-Cu ingots
(Elsevier Science SaLausanneSuíça, 2007)