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The correlation between thermal variables and secondary dendrite arm spacing during solidification of horizontal cylinders of Sn-Pb alloys
(Elsevier Science SaLausanneSuíça, 2005)
Mechanical properties as a function of microstructure and solidification thermal variables of Al-Si castings
(Elsevier Science SaLausanneSuíça, 2006)
Correlation between unsteady-state solidification conditions, dendrite spacings, and mechanical properties of Al-Cu alloys
(Minerals Metals Materials SocWarrendaleEUA, 2000)
Factors affecting solidification thermal variables along the cross-section of horizontal cylindrical ingots
(Elsevier Science SaLausanneSuíça, 2005)
Cellular growth during transient directional solidification of Pb-Sb alloys
(Elsevier Science SaLausanneSuíça, 2006)
Modeling dendritic structure and mechanical properties of Zn-Al alloys as a function of solidification conditions
(Elsevier Science SaLausanneSuíça, 2002)
Microstructure morphologies during the transient solidification of hypomonotectic and monotectic Al-Pb alloys
(Elsevier Science SaLausanneSuíça, 2011)
Alloy Aluminum Solidification in Square Section
(Universidad de TarapacáFacultad de Ingeniería, 2006)
Directional solidification of Sn-Ag-Cu alloys
(Elsevier, 2015-04)
The alloys of Sn-Ag-Cu family (SAC) are candidates for lead-free replacement of Sn-Pb eutectic used in welding processes of electronic devices. These alloys, with eventual adding of Zn, In and Bi highly improves the ...
Sn-Mg lead-free solder alloy: Effect of solidification thermal parameters on microstructural features and microhardness
(2019-11-27)
In the last decade, several studies have been developed on lead-free alloys as potential candidates to replace Sn-Pb alloys in soldering processes. Sn-Mg alloys arise as promising alternatives due to characteristics such ...