Buscar
Mostrando ítems 1-10 de 244
Immersion Corrosion Of Sn-ag And Sn-bi Alloys As Successors To Sn-pb Alloy With Electronic And Jewelry Applications
(Natl Assoc Corrosion EngHouston, 2016)
Electrochemical corrosion of Pb-1 wt% Sn and Pb-2.5 wt% Sn alloys for lead-acid battery applications
(Elsevier Science BvAmsterdamHolanda, 2009)
Analysis of current dendritic growth models during downward transient directional solidification of Sn-Pb alloys
(Elsevier Science BvAmsterdamHolanda, 2005)
Influence of aging on microstructure and hardness of lead-free solder alloys
(Emerald, 2021-01-08)
Purpose: The purpose of this paper is to carry out a study of the evolution of the microstructure and the microhardness of Sn-Cu-Ag alloys from as-cast condition and under artificial isothermal aging at different temperatures ...
Thermosolutal convective effects on dendritic array spacings in downward transient directional solidification of Al-Si alloys
(Elsevier Science SaLausanneSuíça, 2005)
Microstructural development in Al-Sn alloys directionally solidified under transient heat flow conditions
(Elsevier Science SaLausanneSuíça, 2008)
Influence of melt convection on the columnar to equiaxed transition and microstructure of downward unsteady-state directionally solidified Sn-Pb alloys
(Elsevier Science SaLausanneSuíça, 2004)
Cellular growth during transient directional solidification of Pb-Sb alloys
(Elsevier Science SaLausanneSuíça, 2006)
Electrochemical Parameters of Equiaxed and Columnar Grain Arrays of a Pb1wt%Sn Alloy for Lead-Acid Battery Applications
(Electrochemical Science GroupBelgradeSérvia, 2011)
Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloy
(Elsevier Science BvAmsterdamHolanda, 2014)