Purpose: The purpose of this paper is to carry out a study of the evolution of the microstructure and the microhardness of Sn-Cu-Ag alloys from as-cast condition and under artificial isothermal aging at different temperatures ...

SnPb solders, particularly Sn-37 %Pb eutectic alloy, have been widely used as low temperature joining alloys for some time. However, the restriction of Pb use in industry has been strongly promoted to protect the ...

Human health and environmental concerns are not usually considered at the same time. Tin-lead solders are still widely used in several countries, including Brazil, by manufacturers of electronic assemblies. One of the ...

In the last decade, several studies have been developed on lead-free alloys as potential candidates to replace Sn-Pb alloys in soldering processes. Sn-Mg alloys arise as promising alternatives due to characteristics such ...