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Avaliação do arraste dos fios de solda durante o processo de moldagem por transferência no encapsulamento de memórias DRAM
(Universidade do Vale do Rio dos Sinos, 2018-06-06)
The advancement of microelectronics makes more and more portable electronic devices emerge in our daily lives. This brings a number of challenges to the semiconductor chain, from design, to the development of smaller and ...
Avaliação do arraste dos fios de solda durante o processo de moldagem por transferência no encapsulamento de memórias DRAM
(Universidade do Vale do Rio dos Sinos, 2018-06-06)
The advancement of microelectronics makes more and more portable electronic devices emerge in our daily lives. This brings a number of challenges to the semiconductor chain, from design, to the development of smaller and ...
Mapeamento estratégico dos materiais utilizados no encapsulamento de semicondutores
(Universidade do Vale do Rio dos Sinos, 2015-11-25)
In 2013, Brazil was the second largest consumer of electronic equipment in the world. During that period, expenses with electronics in Brazil exceeded those of economic powers such as Japan, Germany, Russia and the United ...
Mapeamento estratégico dos materiais utilizados no encapsulamento de semicondutores
(Universidade do Vale do Rio dos Sinos, 2015-11-25)
In 2013, Brazil was the second largest consumer of electronic equipment in the world. During that period, expenses with electronics in Brazil exceeded those of economic powers such as Japan, Germany, Russia and the United ...