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Diseño de un ambiente de verificación basado en la metodología UVM para un microprocesador RISC-V 32I
(Instituto Tecnológico de Costa Rica, 2018)
The electronics engineering school in the Technology Institute of Costa Rica has now an
investigation project with other universities in South America and Europe, they have been
doing a design of a microprocessor wich ...
A model for computing vibration induced stresses of electronic components in a general flexible mounting
(2013-09-30)
This paper develops a novel full analytic model for vibration analysis of solid-state electronic components. The model is just as accurate as finite element models and numerically light enough to permit for quick design ...
A model for computing vibration induced stresses of electronic components in a general flexible mounting
(2013-09-30)
This paper develops a novel full analytic model for vibration analysis of solid-state electronic components. The model is just as accurate as finite element models and numerically light enough to permit for quick design ...
Proposta de uma plataforma reconfigurável para testes de módulos SDRAM DDR3
(Universidade do Vale do Rio dos Sinos, 2017-09-21)
This work consists on a proposal of a DDR3 SDRAM memory module reconfigurable test platform. Memory module testers are usually closed architecture systems, in which the user has little flexibility in their use. In this ...
Proposta de uma plataforma reconfigurável para testes de módulos SDRAM DDR3
(Universidade do Vale do Rio dos Sinos, 2017-09-21)
This work consists on a proposal of a DDR3 SDRAM memory module reconfigurable test platform. Memory module testers are usually closed architecture systems, in which the user has little flexibility in their use. In this ...
Desenvolvimento de módulos didáticos para eletrônica de potência
(Universidade Tecnológica Federal do ParanáMedianeiraBrasilTecnologia em Manutenção IndustrialUTFPR, 2014-12-03)
This paper presents a pedagogical proposal for understanding the operation of electronic devices for power control. This is the design and implementation of a set of modules to test electronic components and analyze the ...
Carbon Fiber Reinforced Polymer and Epoxy Adhesive Tensile Test Failure Analysis Using Scanning Electron Microscopy
(Univ Fed Sao Carlos, Dept Engenharia Materials, 2017-07-01)
Morphological characteristics analysis before and after tensile tests were studied using scanning electron microscopy (SEM) technique to follow the failure evolution on carbon fiber reinforced polymer (CFRP) and epoxy ...