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Silicon wet etching: hillock formation mechanisms and dynamic scaling properties

Mirabella, D. A.; Suarez, Maria Patricia; Suárez, Gonzalo Pablo; Aldao, Celso Manuel (Elsevier, 2013-10-15)

Surface roughening due to anisotropic wet etching of silicon was studied experimentally and modeled using the Monte Carlo method. Simulations were used to determine the consequences of site-dependent detachment probabilities ...

A contribution of vibrationally excited Cl-2 molecules to GaAs reactive ion etching in Cl-2/Ar

Moshkalyov, SA; Machida, M; Lebedev, SV; Campos, DO (Japan J Applied PhysicsMinato-ku TokyoJapão, 1996)

EVOLUTION OF SURFACE TEXTURES ON N-INP SAMPLES ETCHED PHOTOELECTROCHEMICALLY

FERREIRA, NG; SOLTZ, D; DECKER, F; CESCATO, L (Electrochemical Soc IncPennington, 1995)

Etch and rinse versus self-etching adhesives systems: Tridimensional micromechanical analysis of dentin/adhesive interface

Universidade Estadual Paulista (Unesp); Inst Fed Parana IFPR; Univ Tecnol Fed Parana UTFPR (Elsevier B.V., 2012-06-01)

The purpose of this study was to evaluate stress distribution in the hybrid layer produced by two adhesive systems using three-dimensional finite element analysis (FEA). Four FEA models (M) were developed: Mc, a representation ...

Etch and rinse versus self-etching adhesives systems: Tridimensional micromechanical analysis of dentin/adhesive interface

Universidade Estadual Paulista (Unesp); Inst Fed Parana IFPR; Univ Tecnol Fed Parana UTFPR (Elsevier B.V., 2012-06-01)

Etch and rinse versus self-etching adhesives systems: Tridimensional micromechanical analysis of dentin/adhesive interface

Junior, Manoel M.; Rocha, Eduardo Passos; Anchieta, Rodolfo B.; Archangelo, Carlos Marcelo; Luersen, Marco Antonio (Elsevier B.V., 2013)

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Silicon wet etching: hillock formation mechanisms and dynamic scaling properties

A contribution of vibrationally excited Cl-2 molecules to GaAs reactive ion etching in Cl-2/Ar

EVOLUTION OF SURFACE TEXTURES ON N-INP SAMPLES ETCHED PHOTOELECTROCHEMICALLY

Etch and rinse versus self-etching adhesives systems: Tridimensional micromechanical analysis of dentin/adhesive interface

Etch and rinse versus self-etching adhesives systems: Tridimensional micromechanical analysis of dentin/adhesive interface

Etch and rinse versus self-etching adhesives systems: Tridimensional micromechanical analysis of dentin/adhesive interface

Formation of pyramidal etch hillocks in a Kossel crystal

Dynamics of hillocks formation during wet etching

Hillock sizes after wet etching in silicon

Fission track chemical etching kinetic model

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Silicon wet etching: hillock formation mechanisms and dynamic scaling properties

A contribution of vibrationally excited Cl-2 molecules to GaAs reactive ion etching in Cl-2/Ar

EVOLUTION OF SURFACE TEXTURES ON N-INP SAMPLES ETCHED PHOTOELECTROCHEMICALLY

Etch and rinse versus self-etching adhesives systems: Tridimensional micromechanical analysis of dentin/adhesive interface

Etch and rinse versus self-etching adhesives systems: Tridimensional micromechanical analysis of dentin/adhesive interface

Etch and rinse versus self-etching adhesives systems: Tridimensional micromechanical analysis of dentin/adhesive interface

Formation of pyramidal etch hillocks in a Kossel crystal

Dynamics of hillocks formation during wet etching

Hillock sizes after wet etching in silicon

Fission track chemical etching kinetic model