Buscar
Mostrando ítems 1-10 de 124
Influence of tin additions on the precipitation processes in a Cu-Ni-Zn alloys
(CENIM, 2016)
Influence of tin additions on the precipitation processes in a Cu-Ni-Zn alloys. The influence of 1.1 wt% tin additions on the precipitation hardening of Cu-11 wt% Ni-20 wt% Zn alloy was studied by Differential Scanning ...
Avaliação do Tratamento Térmico de Envelhecimento na Liga Sn-0,7%Cu-0,05%Ni
(Universidade Federal do Rio Grande do NorteBrasilUFRNEngenharia de Materiais, 2019-09-19)
Investigations about the effect of thermal cycles (variations of time and temperature) on the microstructures of Pb-free solder alloys are scarce in the literature. Thus, this work aims to perform a microstructural analysis ...
Experimental analysis of the columnar-to-equiaxed transition in directionally solidified Al-Ni and Al-Sn alloys
(Elsevier Science BvAmsterdamHolanda, 2007)
Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples
(2019-01-01)
Directional solidification experiments coupled with mathematical modelling, drop shape analyses and evaluation of the reaction layers were performed for three different types of joints produced with the Sn-0.7 wt.%Cu solder ...
Non-isothermal Characterization of the Precipitation Hardening of a Cu-11Ni-19Zn-1Sn Alloy
(Springer, 2017)
The precipitation hardening of a Cu-11Ni-19Zn-1Sn alloy has been studied by means of
Differential Scanning Calorimetry (DSC), High-Resolution Transmission Electron Microscopy
(HRTEM), and hardness measurements. The ...
The calorimetric analysis as a tool for studying the aging hardening mechanism of a Cu-10wt%Ni-5.5wt%Sn alloy
(Elsevier, 2016)
The transformations of a Cu-10wt%Ni-5.5wt%Sn alloy as a function of the aging time in the range from room temperature up to 600 degrees C have been followed by Differential Scanning Calorimetry (DSC). The results obtained ...