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Material properties of the skull layers of the primate parietal bone: A single-subject study
(Public Library of Science, 2020-01-01)
The outer cortical table of the parietal bone has been commonly used as a calvarial bone graft site for the craniofacial reconstruction. However, little is known about how removing the outer table may affect the function ...
Material properties of the skull layers of the primate parietal bone: A single-subject study
(Public Library of Science, 2020-01-01)
The outer cortical table of the parietal bone has been commonly used as a calvarial bone graft site for the craniofacial reconstruction. However, little is known about how removing the outer table may affect the function ...
Electromechanical characterization of piezoelectric polymer thin films in a broad frequency range
(Elsevier, 2014-08)
Piezoelectric materials are usually characterized using resonant methods. However, piezoelectric polymers are used in broadband devices, thus requiring characterization over a wide range of frequencies. In this work, we ...
Computational Method to Determine Reflected Ultrasonic Signals From Arbitrary-Geometry Targets
(IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCEstados Unidos, 2010)
Detection and location of surfaces in a 3D environment through a single transducer and ultrasonic spherical caps
(Universidad Nacional de Colombia - Sede Bogotá - Facultad de Ingeniería, 2017-09-01)
In this paper, an ultrasonic arc map method for flat mapping is extended to three-dimensional space replacing the circumference arcs by spherical caps. An enclosed environment is scanned by employing a single ultrasonic ...
Improving ultrasonic imaging of aluminum plates using phase modulation
(2020-01-01)
Conventional techniques for ultrasonic image beamforming use amplitude information to produce the im-ages. Although amplitude images can be obtained with high quality, they can also present limitations regarding dead zone, ...
Transducer Loading Effect on the Performance of PZT-Based SHM Systems
(Institute of Electrical and Electronics Engineers (IEEE), 2014)