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Optimization procedures in the design of continuous induction hardening and tempering installations for magnetic steel bars
(1998-12-01)
An inverse problem concerning the industrial process of steel bars hardening and tempering is considered. The associated optimization problem is formulated in terms of membership functions and, for the sake of comparison, ...
Optimization procedures in the design of continuous induction hardening and tempering installations for magnetic steel bars
(1998-12-01)
An inverse problem concerning the industrial process of steel bars hardening and tempering is considered. The associated optimization problem is formulated in terms of membership functions and, for the sake of comparison, ...
Influence of aging time on the corrosion behavior of 6061 Al alloy in alkaline solution
(Associa????o Brasileira de Corros??o ??? ABRACO, 2016)
Cinética de envelhecimento de aços dual phase de baixa resistência mecânica laminados a frio
(Universidade Federal de Minas GeraisUFMG, 2009-02-16)
The kinetics of static strain aging in cold rolled Dual Phase steels of the 250/450 MPa grade of mechanical strength was studied by means of tensile tests. Two Dual Phase steels, with and without a chromium addition of ...
Implementación y Hardening de un Ambiente de Virtualización para el Manejo de Multiples Servidores de VOIP Sobre una Misma Plataforma Para la Empresa Ecuador OVERSEAS AGENCIES C.A.
(Universidad de Guayaquil. Facultad de Ciencias Matemáticas y Físicas. Carrera de Ingeniería en Networking y Telecomunicaciones, 2016-11)
El servicio de telefonía es un medio de comunicación indispensable en las empresas que permite realizar todo tipo de actividad comercial o personal. El uso de esta tecnología radica en: la calidad de servicio que ofrecen ...
Precipitation kinetics in Al-Zn-Mg commercial alloys
(Elsevier Science SaLausanneSuíça, 2003)
Pre-precipitation study in the 7012 Al-Zn-Mg-Cu alloy by electrical resistivity
(Elsevier Science SaLausanneSuíça, 2002)
EM-based parametric optimization of a transition from microstrip to substrate integrated waveguide interconnect
(9th IEEE Latin-American Test Workshop, 2013)