dc.contributor | Universidade de São Paulo (USP) | |
dc.contributor | Universidade Estadual Paulista (Unesp) | |
dc.date.accessioned | 2015-11-03T15:30:00Z | |
dc.date.available | 2015-11-03T15:30:00Z | |
dc.date.created | 2015-11-03T15:30:00Z | |
dc.date.issued | 2014-01-01 | |
dc.identifier | Electroceramics Vi. Stafa-zurich: Trans Tech Publications Ltd, v. 975, p. 248-253, 2014. | |
dc.identifier | 1022-6680 | |
dc.identifier | http://hdl.handle.net/11449/130182 | |
dc.identifier | 10.4028/www.scientific.net/AMR.975.248 | |
dc.identifier | WOS:000348023200041 | |
dc.identifier | 7730719476451232 | |
dc.identifier | 0000-0001-5762-6424 | |
dc.description.abstract | Alumina thin films have been obtained by resistive evaporation of Al layer, followed by thermal oxidation achieved by annealing in appropriate atmosphere (air or O-2-rich), with variation of annealing time and temperature. Optical and structural properties of the investigated films reveal that the temperature of 550 degrees C is responsible for fair oxidation. Results of surface electrical resistivity, Raman and infrared spectroscopies are in good agreement with this finding. X-ray and Raman data also suggest the crystallization of Si nuclei at glass substrate-alumina interface, which would come from the soda-lime glass used as substrate. The main goal in this work is the deposition of alumina on top of SnO2 to build a transparent field-effect transistor. Some microscopy results of the assembled SnO2/Al2O3 heterostructure are also shown. | |
dc.language | eng | |
dc.publisher | Trans Tech Publications Ltd | |
dc.relation | Electroceramics Vi | |
dc.relation | 0,121 | |
dc.rights | Acesso aberto | |
dc.source | Web of Science | |
dc.subject | Alumina | |
dc.subject | Resistive evaporation | |
dc.subject | Thermal annealing | |
dc.subject | Oxidation | |
dc.title | Al2O3 obtained through resistive evaporation for use as insulating layer in transparent field effect transistor | |
dc.type | Actas de congresos | |