Dielectric Thermal Analysis As A Tool For Quantitative Evaluation Of The Viscosity And The Kinetics Of Epoxy Resin Cure

dc.creatorShigue C.Y.
dc.creatorDos Santos R.G.S.
dc.creatorDe Abreu M.M.S.P.
dc.creatorBaldan C.A.
dc.creatorRobin A.L.M.
dc.creatorRuppert-Filho E.
dc.date2006
dc.date2015-06-30T18:14:40Z
dc.date2015-11-26T14:28:04Z
dc.date2015-06-30T18:14:40Z
dc.date2015-11-26T14:28:04Z
dc.date.accessioned2018-03-28T21:31:14Z
dc.date.available2018-03-28T21:31:14Z
dc.identifier
dc.identifierIeee Transactions On Applied Superconductivity. , v. 16, n. 2, p. 1786 - 1789, 2006.
dc.identifier10518223
dc.identifier10.1109/TASC.2005.869624
dc.identifierhttp://www.scopus.com/inward/record.url?eid=2-s2.0-33746595813&partnerID=40&md5=52c34b245465e104c652513e477d28ae
dc.identifierhttp://www.repositorio.unicamp.br/handle/REPOSIP/103654
dc.identifierhttp://repositorio.unicamp.br/jspui/handle/REPOSIP/103654
dc.identifier2-s2.0-33746595813
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/1246498
dc.descriptionDielectric thermal analysis has been proved as a valuable tool for monitoring the epoxy curing process and the related rheological properties in the fabrication of polymer-matrix composite materials. This technique also has the potential to be applied in the monitoring of magnet impregnation processes as well as in quality control. In this work we present the quantitative evaluation of the viscosity changing and the curing kinetics for a commercial Stycast epoxy resin system at different temperatures through the impedance analysis. The results showed correlation between the real component of the complex impedance and the isothermal reaction extent. Comparing the dielectric analysis result with the viscosity measured by rotational rheometer we observed a similar behavior reported for dynamic mechanic analysis. The results comparison have shown that the kinetics parameters obtained from DSC and DETA analysis showed different sensitivities related to the characteristics of curing stages. We concluded that the dielectric thermal analysis should be applied in quantitative evaluation of cure kinetics. © 2006 IEEE.
dc.description16
dc.description2
dc.description1786
dc.description1789
dc.descriptionEvans, D., Morgan, J.T., Stapleton, G.B., (1968) Epoxy Resins for Superconducting Magnet Impregnation Rep., RHEL-R251. , Rutherford High Energy Laboratory, Chilton, Didcot, UK
dc.descriptionHadad, D.K., Physical and chemical characterization of epoxy resins (1988) Epoxy Resins, pp. 1089-1172. , C. A. May, Ed., 2nd ed. New York: Marcel Dekker
dc.descriptionSenturia, S.D., Sheppard Jr., N.F., Dielectric analysis of thermoset cure (1986) Adv. Pol. Sci., 80, pp. 1-47
dc.descriptionKranbuehl, D.E., Hoff, M.S., Hamilton, T.C., Clark, W.T., Freeman, W.T., Chemical and rheological changes during cure in resin-transfer molding in situ monitoring (1990) Polymer Characterization: Physical Property, Spectroscopic and Chromatographic Methods, Ser. Advances in Chemistry Series 227??, p. 249. , Washington, DC: American Chemical Society
dc.descriptionShigue, C.Y., Baldan, C.A., Ruppert-Filho, E., Monitoring the epoxy curing by the dielectric thermal analysis method (2004) IEEE Trans. Appl. Supercond., 14, pp. 1173-1176
dc.descriptionWisanrakkit, G., Gillham, J.K., The glass transition temperature as an index of chemical conversion for a high-Tg amine/epoxy system: Chemical and diffusion-controlled reaction kinetics (1990) J. Appl. Pol. Sci., 41, pp. 2885-2929
dc.description(2003) Emerson & Cuming, , Stycast 1266 A/B, Bilerica, MA
dc.description(2000) ZPlot for Windows Version 2.3d., , Scribner Associates, Southern Pines, NC
dc.descriptionBellucci, F., Valentino, M., Monetta, T., Nicodemo, L., Kenny, J., Nicolais, L., Mijovic, J., Impedance spectroscopy of reactive polymers (1994) J. Polym. Sci. B: Polym. Phys., 32, pp. 2519-2527
dc.descriptionPrime, B., Thermosets (1997) Thermal Characterization of Polymeric Materials, p. 1380. , E. Turi, Ed. San Diego: Academic Press
dc.descriptionWinter, H.H., Chanbon, F., Analysis of linear viscoelasticity of a crosslinking polymer at the gel point (1986) J. Rheol., 30, pp. 367-382
dc.descriptionGallone, G., Capaccioli, S., Levita, G., Rolla, P.A., Corezzi, S., Dielectric analysis of the linear polymerization of an epoxy resin vol. 50, pp. 545-551, 2001 (2001) Polym. Int., 50, pp. 545-551
dc.descriptionPascault, J.P., Sautereau, H., Verdu, J., Williams, R.J.J., (2002) Thermosetting Polymers, , New York: Marcel Dekker, ch. 3
dc.languageen
dc.publisher
dc.relationIEEE Transactions on Applied Superconductivity
dc.rightsfechado
dc.sourceScopus
dc.titleDielectric Thermal Analysis As A Tool For Quantitative Evaluation Of The Viscosity And The Kinetics Of Epoxy Resin Cure
dc.typeActas de congresos


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