dc.contributorUniversidade Estadual Paulista (UNESP)
dc.creatorLucena, Samuel Euzédice de
dc.date2014-05-27T11:26:14Z
dc.date2016-10-25T18:35:51Z
dc.date2014-05-27T11:26:14Z
dc.date2016-10-25T18:35:51Z
dc.date2011-12-01
dc.date.accessioned2017-04-06T01:54:34Z
dc.date.available2017-04-06T01:54:34Z
dc.identifierProceedings - Frontiers in Education Conference, FIE.
dc.identifier1539-4565
dc.identifier0190-5848
dc.identifierhttp://hdl.handle.net/11449/72848
dc.identifierhttp://acervodigital.unesp.br/handle/11449/72848
dc.identifier10.1109/FIE.2011.6142725
dc.identifierWOS:000300879800030
dc.identifier2-s2.0-84858237230
dc.identifierhttp://dx.doi.org/10.1109/FIE.2011.6142725
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/893683
dc.descriptionThis paper presents a discussion on the potential use of high tech garbage, including electronic waste (e-waste), as a source of mechanisms, sensors and actuators, that can be adapted to improve the reality of microprocessor systems labs, at low cost. By means of some examples, it is shown that entire subsystems withdrawn of high tech equipments can be easily integrated into existing laboratory infrastructure. As examples, first a precision positioning mechanism is presented, which was taken from a discarded commercial ink jet printer and interfaced with a microprocessor board used in the laboratory classes. Secondly, a read/write head and its positioning mechanism has been withdrawn of a retired CD/DVD drive and again interfaced with the microprocessor board. Students who have been using these new experiments strongly approve their inclusion in the lab schedules. © 2011 IEEE.
dc.languageeng
dc.relationProceedings - Frontiers in Education Conference, FIE
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.subjectHands-on education
dc.subjectElectrical engineering labs
dc.subjectHigh tech garbage
dc.subjectElectronic waste
dc.subjectOptical encoders
dc.titleHigh tech garbage can help engineering colleges to improve hands-on education
dc.typeOtro


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