This paper presents an exhaustive analysis of the frequency-dependent series resistance and inductance associated with the distributed model of on-chip interconnects including a ground shield to reduce substrate losses. This analysis identifies the regions where the resistance and inductance curves present different trending due to variations in the current distribution. Furthermore, the apparent discrepancy of experimental curves with the well-known square-root-of-frequency models for the resistance and inductance considering the skin-effect is explained. Measurement results up to 40 GHz show that models involving terms proportional to the square root of frequency are valid provided that the section of the interconnect where the current is flowing is appropriately represented.