Fast analysis of cylindrical microstrip lines printed on substrates composed of multiple layers

Abstract

This letter presents an analysis of microstrip lines that are printed on substrates composed of numerous dielectric layers using a fast technique that comprises the full-wave equivalent circuit and the discrete mode matching method. The validation of the proposed formulation has been done with a commercial package based on the finite-element method and very good agreement has been obtained. As a special application of our technique, we consider the analysis of microstrip lines printed on substrates with dielectric constants that vary according to given graded-index profiles. The profiles are modelled by replacing the substrate by numerous homogeneous dielectric layers. © 2010 Wiley Periodicals, Inc.