info:eu-repo/semantics/article
Mn-Cu Transmetalation as a Strategy for the Assembly of Decoupled Metal-Organic Networks on Sn/Cu(001) Surface Alloys
Fecha
2020-08Registro en:
Machain, Paloma; Fuhr, Javier Daniel; Schneider, S.; Carlotto, Silvia; Casarin, M.; et al.; Mn-Cu Transmetalation as a Strategy for the Assembly of Decoupled Metal-Organic Networks on Sn/Cu(001) Surface Alloys; American Chemical Society; Journal of Physical Chemistry C; 124; 35; 8-2020; 18993-19002
1932-7447
CONICET Digital
CONICET
Autor
Machain, Paloma
Fuhr, Javier Daniel
Schneider, S.
Carlotto, Silvia
Casarin, M.
Cossaro, A.
Verdini, A.
Floreano, L.
Lingenfelder, Magalí Alejandra
Gayone, Julio Esteban
Ascolani, Hugo del Lujan
Resumen
Surface alloying of Cu(001) by Sn deposition is a finely controllable method of tuning the degree of copper reactivity in order to drive the on-surface assembly and synthesis of metal-organic coordination networks. In this work we show that the (32×2)R45° reconstruction of the Sn/Cu(001) surface alloy acts as a weakly interacting substrate ideal for the assembly of rectangular metal-organic networks based on transition metals. As a demonstration, we have grown a two-dimensional coordination network formed by manganese and TCNQ (7,7,8,8-tetracyanoquinodimethane) with 1:1 stoichiometry. In contrast with the same structure grown on Au(111), the use of the Sn/Cu(001) substrate enables a commensurate structure with larger and more regular ordered domains. We show that the formation of a Cu-TCNQ coordination network and subsequent Mn-Cu transmetalation reactions are the key steps of the growth mechanism. Moreover, ab initio density-functional calculations indicate that the system studied in the present work is a unique example of a metal-organic coordination network weakly interacting with the substrate.