A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys

article

Fecha

2018-02

Registro en:

DIAS, Marcelino; COSTA, Thiago A.; SILVA, Bismarck L.; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys. Microelectronics Reliability, [S.L.], v. 81, p. 150-158, fev. 2018. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0026271417305875?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.microrel.2017.12.029

0026-2714

https://repositorio.ufrn.br/handle/123456789/32178

10.1016/j.microrel.2017.12.029

http://repositorioslatinoamericanos.uchile.cl/handle/2250/3974881

Autor

Dias, Marcelino

Costa, Thiago Antônio

Silva, Bismarck Luiz

Spinelli, José Eduardo

Cheunga, Noé

Garcia, Amauri

Institución

Universidade Federal do Rio Grande do Norte (Brasil)

Materias

Tensile properties

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