dc.creatorCruz Duarte, Jorge Mario
dc.creatorAmaya Contreras, Iván Mauricio
dc.creatorCorrea Cely, Carlos Rodrigo
dc.date.accessioned2016-02-25 00:00:00
dc.date.accessioned2022-06-17T20:19:03Z
dc.date.accessioned2022-09-29T14:53:10Z
dc.date.available2016-02-25 00:00:00
dc.date.available2022-06-17T20:19:03Z
dc.date.available2022-09-29T14:53:10Z
dc.date.created2016-02-25 00:00:00
dc.date.created2022-06-17T20:19:03Z
dc.date.issued2016-02-25
dc.identifier1794-1237
dc.identifierhttps://repository.eia.edu.co/handle/11190/4964
dc.identifier10.24050/reia.v12i24.880
dc.identifier2463-0950
dc.identifierhttps://doi.org/10.24050/reia.v12i24.880
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/3778434
dc.description.abstractThis article deals with the design of optimum microchannel heat sinks through Unified Particle Swarm Optimisation (UPSO) and Harmony Search (HS). These heat sinks are used for the thermal management of electronic devices, and we analyse the performance of UPSO and HS in their design, both, systematically and thoroughly. The objective function was created using the entropy generation minimisation criterion. In this study, we fixed the geometry of the microchannel, the amount of heat to be removed, and the properties of the cooling fluid. Moreover, we calculated the entropy generation rate, the volume flow rate of air, the channel width, the channel height, and the Knudsen number. The results of several simulation optimizations indicate that both global optimisation strategies yielded similar results, about 0.032 W/K, and that HS required five times more iterations than UPSO, but only about a nineteenth of its computation time. In addition, HS revealed a greater chance (about three times) of finding a better solution than UPSO, but with a higher dispersion rate (about five times). Nonetheless, both algorithms successfully optimised the design for different scenarios, even when varying the material of the heat sink, and for different heat transfer rates.
dc.description.abstractThis article deals with the design of optimum microchannel heat sinks through Unified Particle Swarm Optimisation (UPSO) and Harmony Search (HS). These heat sinks are used for the thermal management of electronic devices, and we analyse the performance of UPSO and HS in their design, both, systematically and thoroughly. The objective function was created using the entropy generation minimisation criterion. In this study, we fixed the geometry of the microchannel, the amount of heat to be removed, and the properties of the cooling fluid. Moreover, we calculated the entropy generation rate, the volume flow rate of air, the channel width, the channel height, and the Knudsen number. The results of several simulation optimizations indicate that both global optimisation strategies yielded similar results, about 0.032 W/K, and that HS required five times more iterations than UPSO, but only about a nineteenth of its computation time. In addition, HS revealed a greater chance (about three times) of finding a better solution than UPSO, but with a higher dispersion rate (about five times). Nonetheless, both algorithms successfully optimised the design for different scenarios, even when varying the material of the heat sink, and for different heat transfer rates.
dc.languagespa
dc.publisherFondo Editorial EIA - Universidad EIA
dc.relationhttps://revistas.eia.edu.co/index.php/reveia/article/download/880/785
dc.relationNúm. 24 , Año 2015
dc.relation166
dc.relation24
dc.relation151
dc.relation12
dc.relationRevista EIA
dc.rightshttps://creativecommons.org/licenses/by-nc-nd/4.0
dc.rightsinfo:eu-repo/semantics/openAccess
dc.rightsEsta obra está bajo una licencia internacional Creative Commons Atribución-NoComercial-SinDerivadas 4.0.
dc.rightshttp://purl.org/coar/access_right/c_abf2
dc.rightsRevista EIA - 2015
dc.sourcehttps://revistas.eia.edu.co/index.php/reveia/article/view/880
dc.subjectEntropy Generation Minimisation
dc.subjectGlobal Optimization Algorithm
dc.subjectMicrochannel Heat Sink
dc.subjectOptimal Design
dc.titleCOOLING MICROELECTRONIC DEVICES USING OPTIMAL MICROCHANNEL HEAT SINKS
dc.typeArtículo de revista
dc.typeJournal article


Este ítem pertenece a la siguiente institución