Actas de congresos
A 40 Ghz-platform Using Soft Substrates
Registro en:
978-1-5090-2788-0
2016 31st Symposium On Microelectronics Technology And Devices (sbmicro). Ieee, p. , 2016.
WOS:000392469000035
10.1109/SBMicro.2016.7731349
Autor
Finardi
Celio A.; Ponchet
Andre F.; Adamo
Cristina B.; Teixeira
Ricardo C.; Panepucci
Roberto R.; Flacker
Alexander
Institución
Resumen
Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) The paper presents a technological solution for high frequency packaging platform to at least 40 GHz. This approach is based on soft substrate processing. We present results of high frequency packaging of important building blocks, such as bias-T, transimpedance amplifiers. The paper demonstrates a solution for high-frequency hybridization that can be implemented with standard substrates. CTI CNPq [456294/2013-9] SMART Modular Technologies Ltda EMU [09/54045] Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) 31st Symposium on Microelectronics Technology and Devices (SBMicro) AUG 29-SEP 03, 2016 Belo Horizonte, BRAZIL