Artículos de revistas
The Effects Of Microstructure And Ag 3sn And Cu 6sn 5 Intermetallics On The Electrochemical Behavior Of Sn-ag And Sn-cu Solder Alloys
Registro en:
International Journal Of Electrochemical Science. , v. 7, n. 7, p. 6436 - 6452, 2012.
14523981
2-s2.0-84863991674
Autor
Osorio W.R.
Peixoto L.C.
Garcia L.R.
Garcia A.
Spinelli J.E.
Institución
Resumen
The aim of this study is to evaluate the electrochemical corrosion behavior of Sn-2 wt.% Ag and Sn-2.8 wt.% Cu solder alloys in a 0.5 M NaCl solution at 25°C as a function of microstructure features and Ag 3Sn and Cu 6Sn 5 intermetallics. Both Sn-Ag and Sn-Cu alloys are becoming interesting lead-free solder alternatives. Microstructure morphologies obtained from a vertical water-cooled unidirectional solidification system under a cooling rate of about 15 °C/s are analyzed. Electrochemical impedance spectroscopy (EIS) diagrams, potentiodynamic polarization curves and an equivalent circuit analysis were used to evaluate the electrochemical parameters. It was found that although the relative cost 1.5 times higher for the Sn-2Ag alloy compared to that of the Sn-2.8Cu alloy, its corresponding electrochemical behavior is better in terms of polarization resistance, current density and pitting corrosion. This is shown to be intimately associated with the resulting fine and homogeneously distributed Ag 3Sn intermetallic particles in the Sn-rich matrix. © 2012 by ESG. 7 7 6436 6452 Abtew, M., Selvaduray, G., (2000) Mater. Sci. Eng., 27, p. 9 Muller, W.H., (2004) Microelectronics Reliability, 44, p. 190 Shen, J., Chan, Y.C., Liu, S.Y., (2008) Intermetallics, 16, p. 114 Garcia, L.R., Osório, W.R., Peixoto, L.C., Garcia, A., (2009) Materia-Rio de Janeiro, 14, p. 767 Garcia, L.R., Osório, W.R., Peixoto, L.C., Garcia, A., (2010) Mater. Charact., 61, p. 212 Nogita, K., (2010) Intermetallics, 18, p. 145 Li, D., Conway, P.P., Liu, C., (2008) Corros. Sci., 50, p. 995 Song, F., Lee, S.W.R., (2006) Electr. Components and Technology Conference, pp. 891-898 Garcia, L.R., Osório, W.R., Garcia, A., (2011) Mater. Design, 32, p. 300 Osório, W.R., Garcia, L.R., Peixoto, L.C., Garcia, A., (2011) Mater. Design, 32, p. 476 Shen, J., Liu, Y.C., Han, Y.J., Gao, H.X., Wei, C., Yang, Y.Q., (2006) Trans. Nonferrous Met. Soc. China, 16, p. 5 Ochoa, F., Williams, J.J., Chawla, N., (2003) J. Electron. Mater., 32, p. 141 Li, G., Shi, Y., Hao, H., Xia, Z., Lei, Y., Guo, F., (2010) J. Alloys Compd., 491, p. 382 Osório, W.R., Spinelli, J.E., Afonso, C.R.M., Peixoto, L.C., Garcia, A., (2011) Electrochim. Acta, 56, p. 889 Song, F., Lee, S.W.R., (2006) Electr. Components and Technology Conference, pp. 891-898 Machida, J., (2006) J. Japan Inst. Metals, 70, p. 7073 Chinnam, R.K., Fauteux, C., Neuenschwander, J., Janczak-Rusch, J., (2011) Acta Mater., 59, p. 1474 Liu, X., Huang, M., Zhao, Y., Wu, C.M.L., Wang, L., (2010) J. Alloys Compounds, 492, p. 43 Kim, K.S., Huh, S.H., Suganuma, K., (2002) J. Mater. Sci. Eng. A, 333, p. 106 Tamura, N., Ohshita, R., Fujimoto, M., Fujitani, S., Kamino, M., Yonezu, I., (2002) J. Power Sources, 107, p. 48 Shen, J., Liu, Y., Gao, H., (2006) J. Univers. Scie. Technol. Beijing Z, 3, p. 333 Gonzalez, J.E.G., Mirza-Rosca, J.C., (1999) J. Electroanal. Chem., 471, p. 109 Osório, W.R., Cheung, N., Peixoto, L.C., Garcia, A., (2009) Int. J. Electrochem. Sci.,, 4, p. 82 Ruiz, J.A., Rosales, I., Gonzalez-Rodriguez, J.G., Uruchurtu, J., (2010) Int. J. Electrochem. Sci., 5, p. 59 Osório, W.R., Peixoto, L.C., Canté, M.V., Garcia, A., (2010) Electrochim. Acta, 55, p. 4078 Osório, W.R., Peixoto, L.C., Garcia, A., (2010) Mater. Corros., 61, p. 407 Castañeda, I.E., Gonzalez-Rodriguez, J.G., Dominguez-Patiño, G., Sandoval-Jabalera, R., Neri-Flores, M.A., Chacon-Nava, J.G., Martinez-Villafañe, A., (2011) Int. J. Electrochem. Sci.,, 6, p. 40 Barham, H.A., Brahim, S.A., Rozita, Y., Mohamed, K.A., (2011) Int. J. Electrochem. Sci., 6, p. 18 Osório, W.R., Peixoto, L.C., Garcia, A., (2011) Int. J. Electrochem. Sci., 6, p. 1522 Osório, W.R., Moutinho, D.J., Peixoto, L.C., Ferreira, I.L., Garcia, A., (2011) Electrochim. Acta, 56, p. 841 Osório, W.R., Rosa, D.M., Garcia, A., (2011) Electrochim. Acta, 56, p. 845 Osório, W.R., Peixoto, L.C., Moutinho, D.J., Gomes, L.G., Ferreira, I.L., Garcia, A., (2011) Mater. Design, 32, p. 383 Zhang, X.L., Jiang, Z.H., Yao, Z.H., Song, Y., Wu, Z.D., (2009) Corros. Sci., 51, p. 581 Li, D., Conway, P.P., Liu, C., (2008) Corros. Sci., 50, p. 995 NCMS Lead Free Solder Project: A National Program (1999), Carol Handwerker, NEMI Lead Free Solder Meeting, Chicago, May 25