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Influence of aging on microstructure and hardness of lead-free solder alloys
(Emerald, 2021-01-08)
Purpose: The purpose of this paper is to carry out a study of the evolution of the microstructure and the microhardness of Sn-Cu-Ag alloys from as-cast condition and under artificial isothermal aging at different temperatures ...
Comparative Corrosion behaviour of different Sn-based solder alloys
(Springer, 2014-10-24)
SnPb solders, particularly Sn-37 %Pb eutectic alloy, have been widely used as low temperature joining alloys for some time. However, the restriction of Pb use in industry has been strongly promoted to protect the ...
Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys
(Springer, 2015-10-31)
Confiabilidade na instalação de equipamentos de solda por resistência
(Universidade Tecnológica Federal do ParanáCuritibaBrasilCurso de Especialização em Engenharia da ConfiabilidadeUTFPR, 2016-06-01)
Atomistic simulation of soldering iron filled carbon nanotubes
(Elsevier, 2014-07)
The melting and soldering processes of two iron filled carbon nanotubes is explored by means of classical molecular dynamics, in order to develop an understanding of the underlying mechanisms that govern the dynamics of ...
Microstructure-property relations in as-atomized and as-extruded Sn-Cu (-Ag) solder alloys
(Elsevier, 2016-09-25)
Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels
(SAGE Publications, 2018-06-22)
Análise de fluxos de solda e o impacto no processo de soldagem de esferas em encapsulamento do tipo BGA
(Universidade do Vale do Rio dos Sinos, 2016-09-15)
The process of soldering spheres in ball grid array components, called BGA, is critical to the semiconductor packaging, because one failure can generate rejects and undiserable reworks to production performance. The current ...
Análise de fluxos de solda e o impacto no processo de soldagem de esferas em encapsulamento do tipo BGA
(Universidade do Vale do Rio dos Sinos, 2016-09-15)
The process of soldering spheres in ball grid array components, called BGA, is critical to the semiconductor packaging, because one failure can generate rejects and undiserable reworks to production performance. The current ...