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Análise de fluxos de solda e o impacto no processo de soldagem de esferas em encapsulamento do tipo BGA
(Universidade do Vale do Rio dos Sinos, 2016-09-15)
The process of soldering spheres in ball grid array components, called BGA, is critical to the semiconductor packaging, because one failure can generate rejects and undiserable reworks to production performance. The current ...
Análise de fluxos de solda e o impacto no processo de soldagem de esferas em encapsulamento do tipo BGA
(Universidade do Vale do Rio dos Sinos, 2016-09-15)
The process of soldering spheres in ball grid array components, called BGA, is critical to the semiconductor packaging, because one failure can generate rejects and undiserable reworks to production performance. The current ...
Estudo do comportamento à abrasão e formação de revestimentos aplicados por GTAW com dupla alimentação de arames tubulares
(Universidade Tecnológica Federal do ParanáCuritibaBrasilPrograma de Pós-Graduação em Engenharia Mecânica e de MateriaisUTFPR, 2021-02-05)
The present work investigates the formation of coatings using double feeding of tubular wires and the role of the microstructure against the mechanisms of abrasive wear. This study presents an original method, Flux-Cored ...
Some considerations about field theories in commutative and noncommutative spaces
(Universidade Federal de Juiz de Fora (UFJF)BrasilICE – Instituto de Ciências ExatasPrograma de Pós-graduação em FísicaUFJF, 2017)
Avaliação microestrutural da liga Sn-2%Ag-0,7%Cu (SAC207) submetida à tratamento térmico de envelhecimento.
(Universidade Federal do Rio Grande do NorteBrasilUFRNEngenharia de Materiais, 2019-09-18)
Although there are still few studies on lead-free alloys (Pb), in recent years some alternative alloys have been studied, since the presence of this element poses a threat to human health due to its high toxicity. In the ...