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Influence of aging on microstructure and hardness of lead-free solder alloys
(Emerald, 2021-01-08)
Purpose: The purpose of this paper is to carry out a study of the evolution of the microstructure and the microhardness of Sn-Cu-Ag alloys from as-cast condition and under artificial isothermal aging at different temperatures ...
Comparative Corrosion behaviour of different Sn-based solder alloys
(Springer, 2014-10-24)
SnPb solders, particularly Sn-37 %Pb eutectic alloy, have been widely used as low temperature joining alloys for some time. However, the restriction of Pb use in industry has been strongly promoted to protect the ...
Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloy
(Elsevier Science BvAmsterdamHolanda, 2014)
Sn-Mg lead-free solder alloy: Effect of solidification thermal parameters on microstructural features and microhardness
(2019-11-27)
In the last decade, several studies have been developed on lead-free alloys as potential candidates to replace Sn-Pb alloys in soldering processes. Sn-Mg alloys arise as promising alternatives due to characteristics such ...
Microstructure, corrosion behaviour and microhardness of a directionally solidified Sn-Cu solder alloy
(Pergamon-elsevier Science LtdOxfordInglaterra, 2011)
Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys
(SpringerNew YorkEUA, 2009)
Interrelation Of Wettability-microstructure-tensile Strength Of Lead-free Sn-ag And Sn-bi Solder Alloys
(TAYLOR & FRANCIS LTDABINGDON, 2016)
Interrelation Of Wettability-microstructure-tensile Strength Of Lead-free Sn-ag And Sn-bi Solder Alloys
(Taylor & Francis LtdAbingdon, 2016)
Microstructural development and mechanical properties of hypereutectic Sn-Cu solder alloys
(Elsevier Science SaLausanneSuíça, 2013)